From October 28th to October 30th, FASTECH PCB participated in the 12th China International Semiconductor Expo & Summit (IC China).

 

　　The 12th IC China was held in the Shanghai New International Expo Center. The annual summit forum is an important meeting of "IC China", and FASTECH PCB is the model representative unit of 02 Special Project. FASTECH PCB's R&D director of PCB, on behalf of the Company, made a special report and lecture with the subject of the Progress of PCB Technology in Organic PCB Packaging at the forum, fully demonstrating the leading position of FASTECH PCB's PCB technology in China. In addition, FASTECH PCB's exhibition booth once again won the "IC China 2014" Best Exhibition Booth Creative Design and Construction Award, and its exhibit "pressure sensor low warpage thin PCB" won the "Excellent Exhibit Award". This marked that FASTECH PCB's unremitting efforts and rapid development in the semiconductor field has won high recognition from the industry, greatly enhancing the Company's confidence in developing the packaging PCB field and providing powerful impetus for the continuous development of IC packaging PCB and its supporting service.