The three days of exhibition gathered multiple heavyweights in the industry. At the ingeniously designed booth, FASTECH PCB's substrate, SiP packaging, test boards and other exemplary products were well arranged, which fully  displayed the company's image of an advanced electronic manufacturing enterprise which shows its circuit substrate and Tianxin interconnection is based on the design and manufacture of the high-end substrate and the SIP packaging, and attracted the attentions of multiple guests and exhibitors. FASTECH PCB's exhibition staff introduced and promoted the company's latest products and technical routes to the key customers, suppliers, leading enterprises at the upstream and downstream of the industrial chain, which was substantially fruitful.