High Density PCB
HDI PCB (Blind vias)
Material : FR4 S1000-2
Layer : 8
Board thickness : 1.6mm
Copper thickness : 1oz
Surface finish : Immersion gold
Solder mask : Green
Silkscreen : White
Certificate : UL, ISO14001, ISO9001
Min hole size : 0.1mm
Hole type : Blind/Buried
Min line width/space : 3/3mil
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