High Density PCB
HDI PCB (Blind Buried staggered vias, 3+N+3) | HIGH DENSITY PCB
Material : FR4 FR408
Layer : 16
Board thickness : 2.0mm
Copper thickness : 1oz
Surface finish : Immersion gold
Solder mask : Blue
Silkscreen : White
Certificate : UL, ISO14001, ISO9001
Min hole size : 0.1mm
Hole type : Blind/Buried
Min line width/space : 3/3mil
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