Flex PCB
Thermabond Adhesive Thermosetting Adhesive, 3M high adhesion tape Copper Foils (RA or ED)To learn more about RIGID-FLEX PCB, please click here: RIGID-FLEX PCB |
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No. | Item | Technical Data | |
1 | Layer Count | 1~6Layers | |
2 | Min. Line Width/Space | 18um(finish Cu): 3.5/3.5mil | |
35um(finish Cu): 4/4mil | |||
3 | Min Space Between Coverlay Opening | 0.2mm | |
4 | Edge of Coverlay Opening to Trace | 0.20mm(preferred) | |
5 | Min Space between coverlay and solder pad | 0.15mm | |
6 | Polyimide Films | 0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ) | |
7 | Thermabond Adhesive | Thermosetting Adhesive, 3M high adhesion tape | |
8 | Copper Foils (RA or ED) | 1/3oz, 1/2oz, 1oz | |
9 | Stiffeners | Polyimide, Rigid FR4, metal | |
10 | Solder Resist | Coverlay, LPI | |
11 | Min. Finished Hole size | 0.2mm | |
12 | Max. Finished Hole size | 6.30mm | |
13 | Hole tolerance | ±0.05mm | |
14 | Min.space between holes | 0.15mm | |
15 | Minimum conductor edge to outline edge | ≥0.1mm | |
16 | Minimum space between coverlay and conductor | ± 0.15mm | |
17 | Hole to outline edge | ≥ 0.10mm | |
18 | Tooling tolerance | Knife(Soft) tooling | ± 0.25mm |
Steel(Hard) tooling | ± 0.05mm | ||
CNC drill/rout | ± 0.10mm | ||
19 | Maximum Layer to Layer Mis-registration | ± 0.10mm | |
20 | Copper Plated Thickness (PTH only) | 8~15um;20~30um;30~70um(special) | |
21 | Surface Finish | Immersion Gold, Plating Hard Gold, OSP |