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|
| No. |
Item |
Technical Data |
| 1 |
Layer Count |
2~16Layers |
| 2 |
Min. Line Width/Space |
18um(finish Cu): 3.5/3.5mil |
| 35um(finish Cu): 4/4mil |
| 3 |
Min Space Between Coverlay Opening |
0.2mm |
| 4 |
Edge of Coverlay Opening to Trace |
0.20mm(preferred) |
| 5 |
Min Space between coverlay and solder pad |
0.15mm |
| 6 |
Polyimide Films |
0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ), 3 mils (75µ), 4mils(100µ), 5 mils(125µ) as custmer requested |
| 7 |
Thermabond Adhesive |
Acrylic/Modified Acrylic, Modified Epoxy, Polyimide |
| 8 |
Copper Foils (RA or ED) |
1/4oz to 3oz |
| 9 |
FR-4 in Multi-layer Flex Circuits |
Laminated to flex circuit to create rigid flex boards, typically with vias |
| 10 |
Stiffeners |
Polyimide, Rigid FR4, PSA, metal, or customer requested |
| 11 |
Solder Resist |
Coverlay, LPI |
| 12 |
Min. Finished Hole size |
0.2mm |
| 13 |
Max. Finished Hole size |
6.30mm |
| 14 |
Hole tolerance |
±0.05mm |
| 15 |
Min.space between holes |
0.15mm |
| 16 |
Minimum conductor edge to outline edge |
≥0.1mm |
| 17 |
Minimum space between coverlay and conductor |
± 0.15mm |
| 18 |
Hole to outline edge |
≥ 0.10mm |
| 19 |
Tooling tolerance |
Knife(Soft) tooling |
± 0.25mm |
| Steel(Hard) tooling |
± 0.05mm |
| CNC drill/rout |
± 0.10mm |
| 20 |
Maximum Layer to Layer Mis-registration |
± 0.10mm |
| 21 |
Copper Plated Thickness (PTH only) |
8~15um;20~30um;30~70um(special) |
| 22 |
Surface Finish |
Immersion Gold, HASL, Lead free HASL, Plating Hard Gold, OSP |
